Sub-10-nm half-pitch electron-beam lithography by using poly(methyl methacrylate) as a negative resist

Developing high-resolution resists and processes for electron-beam lithography is of great importance for high-density magnetic storage, integrated circuits, and nanoelectronic and nanophotonic devices. Until now, hydrogen silsesquioxane HSQ and calixarene were the only two reported negative resists that could approach sub-10-nm half-pitch resolution for electron-beam lithography. Here, the authors report that 10-nm half-pitch dense nanostructures can also be readily fabricated using the well known poly methyl methacrylate PMMA resist operating in negative tone, even at exposure energies as low as 2 keV. In addition to scanning electron microscopy metrology, transmission electron microscopy metrology was done to confirm the high-resolution capability of negative-tone PMMA. This process was compared to HSQ with salty development and showed similar ultimate resolution, so it could be used as an alternative for applications incompatible with HSQ. © 2010 American Vacuum Society. DOI: 10.1116/1.3501353